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Journal Article 광 통신 송수신 모듈 패키징 기술

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Authors: 고재상

Issue Date: 2002-05

Citation: 전자공학회지, v.29, no.5, pp.109-118

ISSN: 1016-9288

Publisher: 대한전자공학회 (IEIE)

Language: Korean

Type: Journal Article

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