European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5
Language
English
Type
Conference Paper
Project Code
15ZB1400, ESSOP CUBE 기술 기반 차세대 레이더 3D 모듈 개발,
Lee Jin Ho
Abstract
Isotropic conductive paste (ICP) has been continuously developed to get a good electrical performance for the semiconductor packaging applications. The conductivity of the ICP material is simply determined based on the contact between adjacent metal particles in a polymer matrix. Therefore, the mechanical shock applied on the semiconductor package can be a bad point of the adhesive strength between the substrate and polymeric matrix in the ICP material. In the present research, an isotropic conductive paste based on epoxy with Ag coated copper and solder was investigated. An isotropic conductive paste, called a hybrid Cu paste (HCP), which is composed of fluxing resin, Ag-coated Cu flakes, and solder powder, is placed between the top and bottom substrates. With increase of process temperature, the solder particles placed between the Ag coated Cu particles, as well as between the metal pads and Ag coated Cu particles, are eventually melted, thereby performing electrical interconnections through solder wetting owing to the oxide on the surface of the solder particles and metal pads being removed by the fluxing resin matrix. Specially, nano Ag coated Cu flakes was used to decrease the electrical performance as well as to keep the minimum viscosity at room temperature. After completion of curing processing, the fluxing resin is solidified due to the chemical reaction of epoxy resin. The electrical and mechanical interconnections of the hybrid Cu paste are strongly dependent on the wettability of the solder as well as by the adhesion of the resin matrix between the metal substrate and conductive filler, while that of a conventional ICA with silver particles is only determined by the shrinkage and adhesion strength of the resin matrix during processing.
KSP Keywords
Adhesion strength, Adhesive strength(68.35.G), Ag coated Cu particles, Conductive paste, Cu paste, Epoxy resin, Mechanical Shock, Metal particles, Polymeric matrix, Process temperature, Resin matrix
Copyright Policy
ETRI KSP Copyright Policy
The materials provided on this website are subject to copyrights owned by ETRI and protected by the Copyright Act. Any reproduction, modification, or distribution, in whole or in part, requires the prior explicit approval of ETRI. However, under Article 24.2 of the Copyright Act, the materials may be freely used provided the user complies with the following terms:
The materials to be used must have attached a Korea Open Government License (KOGL) Type 4 symbol, which is similar to CC-BY-NC-ND (Creative Commons Attribution Non-Commercial No Derivatives License). Users are free to use the materials only for non-commercial purposes, provided that original works are properly cited and that no alterations, modifications, or changes to such works is made. This website may contain materials for which ETRI does not hold full copyright or for which ETRI shares copyright in conjunction with other third parties. Without explicit permission, any use of such materials without KOGL indication is strictly prohibited and will constitute an infringement of the copyright of ETRI or of the relevant copyright holders.
J. Kim et. al, "Trends in Lightweight Kernel for Many core Based High-Performance Computing", Electronics and Telecommunications Trends. Vol. 32, No. 4, 2017, KOGL Type 4: Source Indication + Commercial Use Prohibition + Change Prohibition
J. Sim et.al, “the Fourth Industrial Revolution and ICT – IDX Strategy for leading the Fourth Industrial Revolution”, ETRI Insight, 2017, KOGL Type 4: Source Indication + Commercial Use Prohibition + Change Prohibition
If you have any questions or concerns about these terms of use, or if you would like to request permission to use any material on this website, please feel free to contact us
KOGL Type 4:(Source Indication + Commercial Use Prohibition+Change Prohibition)
Contact ETRI, Research Information Service Section
Privacy Policy
ETRI KSP Privacy Policy
ETRI does not collect personal information from external users who access our Knowledge Sharing Platform (KSP). Unathorized automated collection of researcher information from our platform without ETRI's consent is strictly prohibited.
[Researcher Information Disclosure] ETRI publicly shares specific researcher information related to research outcomes, including the researcher's name, department, work email, and work phone number.
※ ETRI does not share employee photographs with external users without the explicit consent of the researcher. If a researcher provides consent, their photograph may be displayed on the KSP.