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Conference Paper Electrically Conductive Paste with Copper for Flexible Packaging Application
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Authors
Yong-Sung EOM, Jihye SON, Hyun-Cheol BAE, Haksun Lee, Kwang-Seong CHOI, Seung-Eon MOON
Issue Date
2015-10
Citation
International Symposium on Microelectronics and Packaging (ISMP) 2015, pp.144-144
Language
English
Type
Conference Paper
KSP Keywords
Conductive paste, Electrically conductive, Flexible packaging