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Conference Paper Cost-Effective Thermoelectric Cooler Module Using Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and Solder

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Authors: Hyun-Cheol Bae, Yong-Sung Eom, Haksun Lee, Kwang-Seong Choi, Seung Eon Moon

Issue Date: 2015-10

Citation: International Symposium on Microelectronics and Packaging (ISMP) 2015, pp.136-136

Language: English

Type: Conference Paper

KSP Keywords: Conductive paste, Thermoelectric cooler, cost-effective

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