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Journal Article
Novel Bumping Material for Solder-on-Pad Technology
- Authors
- Kwang-Seong Choi, Sun-Woo Chu, Jong-Jin Lee, Ki-Jun Sung, Hyun-Cheol Bae, Byeong-Ok Lim, Jong-Tae Moon, Yong-Sung Eom
- Issue Date
- 2011-08
- Citation
- ETRI Journal, v.33, no.4, pp.637-640
- ISSN
- 1225-6463
- Publisher
- 한국전자통신연구원 (ETRI)
- Language
- English
- Type
- Journal Article
- Abstract
- A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flipchip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 챙m in one direction. © 2011 ETRI.
- KSP Keywords
- Cleaning process, Solder bump, chemical reaction(Biomimetic), fine pitch, oxide layer