상세정보
학술지
Novel Bumping Material for Solder-on-Pad Technology
- 발행일
- 201108
- 출처
- ETRI Journal, v.33 no.4, pp.637-640
- ISSN
- 1225-6463
- 출판사
- 한국전자통신연구원 (ETRI)
- 협약과제
- 10MB2100, 웨이퍼레벨 3차원 IC 설계 및 집적기술, 최광성
- 초록
- A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flipchip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 챙m in one direction. © 2011 ETRI.
- KSP 제안 키워드
- Cleaning process, Fine pitch, Oxide layer, Solder bump, chemical reaction(Biomimetic)