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Journal Article Development of Flat-Plate Cooling Device for Electronic Packaging
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Authors
Seok-Hwan Moon, Gunn Hwang, Hyun-Taeck Lim
Issue Date
2011-08
Citation
ETRI Journal, v.33, no.4, pp.645-647
ISSN
1225-6463
Publisher
한국전자통신연구원 (ETRI)
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.4218/etrij.11.0210.0322
Project Code
09MB7700, 솔라셀 증착용 온도균일화 장치 개발, Moon Seok-Hwan
Abstract
In this study, a microcapillary pumped loop (MCPL) that can be used as a cooling device for small electronic and telecommunications equipment has been developed. For thin devices such as an MCPL, securing a vapor flow space is a critical issue for enhancing the thermal performance. In this letter, such enhancement in thermal performance was accomplished by eliminating condensed droplets from the vapor line. By fabricating the grooves in the vapor line to eliminate droplets, a decrease in thermal resistance of about 63.7% was achieved. © 2011 ETRI.
KSP Keywords
Flat plate, Flow space, Vapor flow, cooling device, electronic packaging, thermal performance, thermal resistance