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Detail
Journal Article
Development of a Flat-Plate Cooling Device for Electronic Packaging
- Authors
- Seok-Hwan Moon, Gunn Hwang, Hyun-Taeck Lim
- Issue Date
- 2011-08
- Citation
- ETRI Journal, v.33, no.4, pp.645-647
- ISSN
- 1225-6463
- Publisher
- 한국전자통신연구원 (ETRI)
- Language
- English
- Type
- Journal Article
- Abstract
- In this study, a microcapillary pumped loop (MCPL) that can be used as a cooling device for small electronic and telecommunications equipment has been developed. For thin devices such as an MCPL, securing a vapor flow space is a critical issue for enhancing the thermal performance. In this letter, such enhancement in thermal performance was accomplished by eliminating condensed droplets from the vapor line. By fabricating the grooves in the vapor line to eliminate droplets, a decrease in thermal resistance of about 63.7% was achieved. © 2011 ETRI.
- KSP Keywords
- Electronic Packaging, Flat plate, Flow space, Vapor flow, cooling device, thermal performance, thermal resistance