상세정보
학술지
Development of Flat-Plate Cooling Device for Electronic Packaging
- 발행일
- 201108
- 출처
- ETRI Journal, v.33 no.4, pp.645-647
- ISSN
- 1225-6463
- 출판사
- 한국전자통신연구원 (ETRI)
- 초록
- In this study, a microcapillary pumped loop (MCPL) that can be used as a cooling device for small electronic and telecommunications equipment has been developed. For thin devices such as an MCPL, securing a vapor flow space is a critical issue for enhancing the thermal performance. In this letter, such enhancement in thermal performance was accomplished by eliminating condensed droplets from the vapor line. By fabricating the grooves in the vapor line to eliminate droplets, a decrease in thermal resistance of about 63.7% was achieved. © 2011 ETRI.
- KSP 제안 키워드
- Flat plate, Flow space, Vapor flow, cooling device, electronic packaging, thermal performance, thermal resistance