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Journal Article Fabrication of large-core 1 x 16 optical power splitters in polymers using hot-embossing process
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Authors
Choon-Gi Choi, Sang-Pil Han, Byeong Cheol Kim, Seung-Ho Ahn, Myung-Yung Jeong
Issue Date
2003-06
Citation
IEEE Photonics Technology Letters, v.15, no.6, pp.825-827
ISSN
1041-1135
Publisher
IEEE
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1109/LPT.2003.811139
Abstract
Large-core (42 × 43 μm) 1 × 16 optical power splitters in polymers have been fabricated. Y-branch waveguide structures with and without offsets in the arc-bending regions were designed by the beam propagation method software and molded by a silicon-mold master using a hot-embossing process. The optical power splitters were produced by epoxy core filling and ultraviolet curing processes. The average insertion losses at a wavelength of 850 nm were measured to be 19.8 dB with offset and 17.1 dB without offset, respectively. The maximum uniformities were 3.3 dB with offset and 3.9 dB without offset, respectively.
KSP Keywords
850 nm, Optical power, Power splitters, Ultraviolet curing, Waveguide Structure, Y-branch, beam propagation method, branch waveguide, curing process, hot embossing, insertion loss