상세정보
학술지
Fabrication of large-core 1 x 16 optical power splitters in polymers using hot-embossing process
- 발행일
- 200306
- 출처
- IEEE Photonics Technology Letters, v.15 no.6, pp.825-827
- ISSN
- 1041-1135
- 출판사
- IEEE
- 협약과제
- 01MM3400, 100Gbps급 집적형 광배선 모듈, 정명영
- 초록
- Large-core (42 × 43 μm) 1 × 16 optical power splitters in polymers have been fabricated. Y-branch waveguide structures with and without offsets in the arc-bending regions were designed by the beam propagation method software and molded by a silicon-mold master using a hot-embossing process. The optical power splitters were produced by epoxy core filling and ultraviolet curing processes. The average insertion losses at a wavelength of 850 nm were measured to be 19.8 dB with offset and 17.1 dB without offset, respectively. The maximum uniformities were 3.3 dB with offset and 3.9 dB without offset, respectively.
- KSP 제안 키워드
- 850 nm, Optical power, Power splitters, Ultraviolet curing, Waveguide Structure, Y-branch, beam propagation method, branch waveguide, curing process, hot embossing, insertion loss