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Conference Paper Packaging technology for wavelength tunable filter based on optical MEMS
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Authors
Yong-Sung Eom, Jong-Hyun Lee, Byung-Suk Choi, Jong-Deog Kim, Ho-Gyeong Yun, Kwang-Seong Choi, Jong-Tae Moon, Myung-Lae Lee, Chang-Auck Choi, Chi-Hoon Jun
Issue Date
2003-08
Citation
IEEE LEOS International Conference on Optical MEMS 2003, pp.67-68
Publisher
IEEE
Language
English
Type
Conference Paper
DOI
https://dx.doi.org/10.1109/OMEMS.2003.1233470
Abstract
One of the key components for the WDM optical communication is a wavelength tunable filter. The packaging technology of the tunable filter with Fabry-Perot cavity based on optical MEMS is investigated for the low power consumption and mass production. The flip chip process with Au-20(wt.%)Sn solder was conducted to integrate two DBR mirrors in parallel with a constant distance for the simple design of packaging structure. TEC fiber was used to achieve a wide range of the optical alignment tolerance for the high coupling efficiency.
KSP Keywords
Constant distance, DBR mirrors, Fabry-Perot cavity, High coupling efficiency, Key Components, Optical alignment, Packaging structure, Packaging technology, Simple design, Tunable filters(TFs), Wavelength tunable