상세정보
학술지
An InGaP-GaAs HBT MMIC smart power amplifier for W-CDMA mobile handsets
- 발행일
- 200306
- 출처
- IEEE Journal of Solid-State Circuits, v.38 no.6, pp.905-910
- ISSN
- 0018-9200
- 출판사
- IEEE
- 초록
- We demonstrate a new linearized monolithic microwave integrated circuit smart power amplifier of extraordinary high power-added efficiency (PAE), especially at the most probable transmission power of wide-band code-division multiple-access handsets. A PAE of 21% at 16 dBm of output power, which is the maximum bound of the most probable transmission power in IS-95 systems, was obtained, as well as 40% at 28 dBm, the required maximum output power, with a single-chip MMIC power amplifier. The power amplifier has been devised with two InGaP-GaAs heterojunction bipolar transistor amplifying chains parallel connected, each chain being optimized for a different P1 dB dB (1-dB compression point) value: one for 16 dBm for the low-power mode, targeting the most probable transmission power, and the other for 28 dBm for the high-power mode. The high-power mode operation shows 40% of PAE and -30 dBc of adjacent channel leakage power ratio (ACLR) at the maximum output power of 28 dBm. The low-power mode operation exhibits -34 dBc of ACLR at 16 dBm with 14 mA of a quiescent current. This amplifier improves power usage efficiency and, consequently, the battery lifetime of the handset by a factor of three.
- KSP 제안 키워드
- 1-dB compression point, Adjacent channel leakage ratio(ACLR), As 4, Battery lifetime, Code division Multiple Access(CDMA), GaAs HBT, GaAs heterojunction bipolar transistor, Heterojunction Bipolar Transistors(HBTs), High power, Leakage power, Low-Power