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Passive alignment method of polymer PLC devices by using a hot embossing technique
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- Authors
- Jin Tae Kim, Keun Byoung Yoon, Choon-Gi Choi
- Issue Date
- 2004-07
- Citation
- IEEE Photonics Technology Letters, v.16, no.7, pp.1664-1666
- ISSN
- 1041-1135
- Publisher
- IEEE
- Language
- English
- Type
- Journal Article
- Abstract
- A novel fabrication process using a hot embossing technique has been developed for micromechanical passive alignment of polymer planar lightwave circuit (PLC) devices. With only one step of embossing, single-mode waveguide straight channels and micropedestals for passive aligning are simultaneously defined on a polymer thin film with an accuracy of 짹0.5 μm. This process reduces the steps for fabricating alignment structures. A fabricated polymer PLC chip and fibers are combined on a v-grooved silicon optical bench (SiOB) in a flip-chip manner. The process provides a coupling loss as low as 0.67 dB per coupling face and a cost-effective packaging solution for various polymer PLC devices. © 2004 IEEE.
- KSP Keywords
- Alignment method, Coupling loss, Hot embossing technique, One-step, Packaging solution, Planar lightwave circuit(PLC), Polymer PLC, Polymer thin films, Silicon optical bench(SIOB), Single-mode waveguide, alignment structures