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학술지 Optical backplane system using waveguide-embedded PCBs and optical slots
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윤근병, 조인귀, 안승호, Myung Yong Jeong, Deug Ju Lee, Young Un Heo, Byung Sup Rho, Hyo-Hoon Park, Byoung-Ho (Tiger) Rhee
IEEE/OSA Journal of Lightwave Technology, v.22 no.9, pp.2119-2127
Optical Society of America (OSA)
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As discussed in this paper, a practical optical backplane system was demonstrated, using a waveguide-embedded optical backplane board, processing boards, and optical slots for board-to-board interconnection. A metal optical bench was used as a packaging die for the optical devices and the integrated circuit chips in both the transmitter and the receiver processing boards. The polymer waveguide was produced by means of a hot-embossing technique and was then embedded following a conventional lamination processes. The average propagation loss of these waveguides was approximately 0.1 dB/cm at 850 nm. The dimension and optical properties of the waveguide in an optical backplane board were unchanged after lamination. As connection components between transmitter/receiver processing boards and an optical backplane board, optical slots were used for easy and repeatable insertion and extraction of the boards with a micrometer-scale precision. A 1 × 4 850-nm vertical-cavity surface-emitting laser array was used with 2 dBm of output power for the transmitter and a p-i-n photodiode array for the receiver. This paper successfully demonstrates 8 Gb/s of data transmission between the transmitter processing board and the optical backplane board. © 2004 IEEE.
KSP 제안 키워드
850 nm, Board-to-board, Data transmission, Integrated circuit, Laser array, Optical backplane, Optical devices, Output power, P-i-n photodiodes(PDs), Photodiode array, Propagation loss