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Journal Article
Optical backplane system using waveguide-embedded PCBs and optical slots
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- Authors
- Keun Byoung Yoon, In-Kui Cho, Seung Ho Ahn, Myung Yong Jeong, Deug Ju Lee, Young Un Heo, Byung Sup Rho, Hyo-Hoon Park, Byoung-Ho (Tiger) Rhee
- Issue Date
- 2004-09
- Citation
- IEEE/OSA Journal of Lightwave Technology, v.22, no.9, pp.2119-2127
- ISSN
- 0733-8724
- Publisher
- Optical Society of America (OSA)
- Language
- English
- Type
- Journal Article
- Abstract
- As discussed in this paper, a practical optical backplane system was demonstrated, using a waveguide-embedded optical backplane board, processing boards, and optical slots for board-to-board interconnection. A metal optical bench was used as a packaging die for the optical devices and the integrated circuit chips in both the transmitter and the receiver processing boards. The polymer waveguide was produced by means of a hot-embossing technique and was then embedded following a conventional lamination processes. The average propagation loss of these waveguides was approximately 0.1 dB/cm at 850 nm. The dimension and optical properties of the waveguide in an optical backplane board were unchanged after lamination. As connection components between transmitter/receiver processing boards and an optical backplane board, optical slots were used for easy and repeatable insertion and extraction of the boards with a micrometer-scale precision. A 1 × 4 850-nm vertical-cavity surface-emitting laser array was used with 2 dBm of output power for the transmitter and a p-i-n photodiode array for the receiver. This paper successfully demonstrates 8 Gb/s of data transmission between the transmitter processing board and the optical backplane board. © 2004 IEEE.
- KSP Keywords
- 850 nm, Board-to-board, Data transmission, Integrated circuit, Laser array, Optical backplane, Optical devices, Output power, PIN photodiodes, Photodiode array, Propagation loss