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Journal Article A Two-Step Etching Technique for Silica Terraces in the PLC Hybrid Integration
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Authors
Young Tak Han, Sang Ho Park, Jang Uk Shin, Duk Jun Kim, Yoon Jung Park, Sung Woong Park, Jong Deog Kim, Hee Kyung Sung
Issue Date
2004-11
Citation
Photonics Technology Letters, v.16, no.11, pp.2436-2438
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1109/LPT.2004.835219
Project Code
04MB2600, Photonic device integrated module for optical access network, Oh Kwang Ryong
Abstract
Two-step etching, after the full processes of a silica waveguide, was performed to fabricate a silica-terraced planar lightwave circuit platform for the hybrid integration of optoelectronic devices. Spot-size converted distributed feedback laser diodes (SSC DFB LDs) were flip-chip bonded on silica terraces with the height accuracy of less than 1 μm, and the resultant coupling loss between the SSC DFB LD and the silica waveguide was about 3.78 dB. The fight-current curve of the LD filp-chip bonded on the platform showed the almost linear increase of the output power without any saturation. © 2004 IEEE.
KSP Keywords
Coupling loss, Distributed feedback laser diode, Distributed feedback lasers(DFBs), Etching technique, Height accuracy, Hybrid Integration, Laser diode(LD), Linear increase, Output power, Planar lightwave circuit(PLC), Silica waveguide