상세정보
학술지
Optimization of Packaging Design of TWEAM Module for Digital and Analog Applications
- 발행일
- 200412
- 출처
- ETRI Journal, v.26 no.6, pp.589-596
- ISSN
- 1225-6463
- 출판사
- 한국전자통신연구원 (ETRI)
- 협약과제
- 04MB1200, 60GHz Pico Cell 통신용 SoP(구:60GHz 광대역 무선 LAN 기술 개발), 조경익
- 초록
- Packaging technologies for a broadband and narrowband modulator with a traveling wave electro-absorption modulator (TWEAM) device were developed. In developing a broadband modulator, the effects of the device and packaging designs on the broadband performance were investigated. The optimized designs were obtained through a simulation with the result that we developed a broadband modulator with a 3 dB bandwidth of 38 GHz in the electrical-to-optical (E/O) response, an electrical return loss of less than -10 dB at up to 26 GHz, an rms jitter of 1.832 ps, and an extinction ratio of 538 dB in a 40 Gbps non-return to zero (NRZ) eye diagram. For analog application, the effect of the RF termination scheme on the fractional bandwidth was studied. The microstrip line with a double stub as a matching circuit and a laser trimming process were used to obtain an S11 of -34.58 dB at 40 GHz and 2.9 GHz bandwidth of less than -15 dB.
- KSP 제안 키워드
- 3-dB bandwidth, 38 GHz, 6 GHz, Eye Diagram, Fractional Bandwidth(FBW), Microstrip Line, Packaging Design, Return loss(RL), Traveling wave, analog application, electroabsorption modulator(EAM)