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Journal Article SOI single-electron transistor with low RC delay for logic cells and SET/FET hybrid ICs
Cited 42 time in scopus Share share facebook twitter linkedin kakaostory
Authors
Kyu-Sul Park, Sang-Jin Kim, In-Bok Baek, Won-Hee Lee, Jong-Seuk Kang, Yong-Bum Jo, Sang Don Lee, Chang-Keun Lee, Jung-Bum Choi, Jang-Han Kim, Keun-Hyung Park, Won-Ju Cho, Moon-Gyu Jang, Seong-Jae Lee
Issue Date
2005-03
Citation
IEEE Transactions on Nanotechnology, v.4, no.2, pp.242-248
ISSN
1536-125X
Publisher
IEEE
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1109/TNANO.2004.837857
Abstract
We report on a successful fabrication of silicon-based single-electron transistors (SETs) with low RC time constant and their applications to complementary logic cells and SET/field-effect transistor (FET) hybrid integrated circuit. The SETs were fabricated on a silicon-on-insulator (SOI) structure by a pattern-dependent oxidation (PADOX) technique, combined with e-beam lithography. Drain conductances measured at 4.2 K approach large values of the order of microsiemens, exhibiting Coulomb oscillations with peak-to-valley current ratios ?돧1000. Data analysis with a probable mechanism of PADOX yields their intrinsic speeds of ~2 THz, which is within an order of magnitude of the theoretical quantum limit. Incorporating these SETs as basic elements, in-plane side gate-controlled complementary logic cells and SET/FET hybrid integrated circuits were fabricated on an SOI chip. Such an in-plane structure is very efficient in the Si fabrication process, and the side gates adjacent to the electron island could easily control the phase of Coulomb oscillations. The input-output voltage transfer, characteristic of the logic cell, shows an inverting behavior where the output voltage gain is estimated to be about 1.2 at 4.2 K. The SET/FET hybrid integrated circuit consisting of one SET and three FETs yields a high-voltage gain and power amplification with a wide-range output window for driving the next circuit. The small SET input gate voltage of 30 mV is finally converted to 400 mV, corresponding to an amplification ratio of 13. © 2005 IEEE.
KSP Keywords
Amplification ratio, Data analysis, E-beam lithography, Fabrication process, Field Effect Transistor(FET), Gate voltage, Gate-controlled, High voltage gain, Input-Output, Logic Cell, Output Voltage