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Conference Paper High Performance Thermoelectric Cooler Module Using Hybrid Cu Paste and Si Substrate

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Authors: Hyun-Cheol Bae, Yong-Sung Eom, Haksun Lee, Kwang-Seong Choi, Seung Eon Moon

Issue Date: 2015-11

Citation: International Conference on Advanced Electromaterials (ICAE) 2015, pp.1-1

Language: English

Type: Conference Paper

KSP Keywords: Cu paste, High performance, Si substrate, Thermoelectric cooler

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