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Conference Paper High Performance Thermoelectric Cooler Module Using Hybrid Cu Paste and Si Substrate
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Authors
Hyun-Cheol Bae, Yong-Sung Eom, Haksun Lee, Kwang-Seong Choi, Seung Eon Moon
Issue Date
2015-11
Citation
International Conference on Advanced Electromaterials (ICAE) 2015, pp.1-1
Language
English
Type
Conference Paper
KSP Keywords
Cu paste, High performance, Si substrate, Thermoelectric cooler