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학술대회
Silicon Window for Low-Price Thermal Imaging System
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- 저자
- 성병목, 손수희, 권선영, 장원익, 공겅호
- 발행일
- 201511
- 출처
- International Microprocesses and Nanotechnology Conference (MNC) 2015, pp.1-2
- 초록
- An infrared (IR) bolometer measures the change of resistance by absorbing incident IR radiation and generates a signal as a function of the radiation intensity. Since a bolometer requires temperature stabilization and light filtering except for the infrared rays, it is essential for the device to be packaged meeting conditions that above mentioned. Minimization of heat loss is needed in order to stabilize temperature of bolometer. Heat loss by conduction or convection requires a medium, so the heat loss will be minimized if the medium is a vacuum. Therefore, vacuum packaging for bolometer is necessary. Another important element in bolometer packaging is germanium (Ge) window, which transmits IR radiation to heat the bolometer. To ensure a complete transmittance of IR light, anti-reflection (AR) coatings are deposited on both sides of the window. Although the transmittance of Ge window is high for IR rays, it is difficult to use frequently in low-price IR bolometer because of its high price. In this paper, we fabricated IR window by utilizing silicon (Si) substrate instead of Ge in order to reduce the cost of bolometer packaging. To enhance the IR transmittance through Si substrate, it is textured using Reactive Ion Etching (RIE). The texturing process of Si substrate is performed along with the change of experimental conditions such as gas ratio, pressure, etching time and RF power.
- KSP 제안 키워드
- Anti-Reflection, Gas ratio, Heat loss, IR light, IR radiation, IR transmittance, IR window, Infrared rays, RF Power, Radiation intensity, Reactive ion etching(RIE)