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Conference Paper
박판형 히트파이프의 모세관력 향상을 위한 구조 개발
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- Issue Date
- 2015-11
- Citation
- 대한기계학회 창립 70주년 기념 학술 대회 2015, pp.978-981
- Publisher
- 대한기계학회
- Language
- Korean
- Type
- Conference Paper
- Abstract
- Considering using the heat pipe in Electronic Telecommunication Fields is in incremental increase. Especially in the electronic packaging application, the thin flat heat pipe has relatively higher applicability compared with the circular heat pipe. The thin flat heat pipe(TFHP) could be realized by pressing the circular heat pipe or welding two plates, however the envelope for the thin flat heat pipe with the total thickness of 2㎜ was obtained by the extrusion process through the present study. The thin flat heat pipe has the simple capillary wick structure consisting of rectangular cross sectional grooves built on the inner wall of that. Although the groove is simple as the capillary wick and many of that are built on the inner wall, it is difficult to realize a relatively high capillary force by the grooves. In the present study, to overcome the poor capillary force in the thin flat heat pipe with grooves, the thin flat heat pipe with wire bundle was fabricated and tested. Through the performance test, the thin flat heat pipe with the wire bundle showed the lower thermal resistance about 3.4 times and higher heat transfer rate about 3.8 times than the thin flat heat pipe with grooves as the capillary wick respectively. The possibility of the wire bundle in the thin flat heat pipe as the capillary wick was validated in the present study and the study for commercializing will be followed in the future.
- KSP Keywords
- Capillary wick, Electronic Packaging, Extrusion process, Heat transfer rate, Inner wall, Performance Test, Thin flat, Wick structure, capillary force, flat heat pipe, thermal resistance