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Conference Paper
Monolithic electronic nose system fabricated by post CMOS micromachining
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- Authors
- Seong M. Cho, Sang Choon Ko, Seung-Chul Ha, Yong Shin Kim, Young Jun Kim, Yoonseok Yang, Hyeon-Bong Pyo, Chang Auck Choi
- Issue Date
- 2005-11
- Citation
- SENSORS 2005, pp.420-423
- Language
- English
- Type
- Conference Paper
- Abstract
- A monolithic electronic nose system, which has 12 independent channels, was fabricated by post CMOS micromachining process. Read-out integrated circuits were fabricated with the standard CMOS processes with design rule of 0.8 μm. And, the MEMS parts of the electronic nose were fabricated by hybrid etching, composed of bulk micromachining with TMAH (Tetramethy lammonium hydroxide) and deep dry etching, on the backside of the wafer after the CMOS processes. Resistance matching circuit, Instrumentation amplifier, multiplexer, and transducer circuits with bridge structure were included in the read-out circuitry. And, heat control circuits were also implanted in the monolithic circuit to maintain the temperature of the MEMS sensing parts as constant. Carbon black-polymer composites and Au nano-particles were used as sensor materials. The MEMS parts of the electronic nose were designed to have well-shaped structures. These structures are considered to be suitable for drop coating procedure. © 2005 IEEE.
- KSP Keywords
- Au nanoparticles(Au-NPs), Bridge structure, Bulk Micromachining, CMOS Process, Control Circuit, Design rule, Drop-coating, Electronic Nose(E-Nose), Electronic nose system, Heat control, Integrated circuit