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Conference Paper
Thermal characterization of MMIC by Numerical Analysis
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- Authors
- Chang Soo Kwak, Jin Cheol Jung, Dong Pil Chang, In Bok Yom
- Issue Date
- 2005-12
- Citation
- Asia-Pacific Microwave Conference (APMC) 2005, pp.1-4
- Publisher
- IEEE
- Language
- English
- Type
- Conference Paper
- Abstract
- Thermal resistances (Rth) of monolithic microwave integrated circuits (MMIC) for the Ka-band communications satellite's transponder, which is being developed by ETRI, have been calculated by the finite element method (FEM). Through the analyses of finite element models with or without selective metal layers, additional MMIC's thermal characteristics have been found and a reasonably simplified finite element modeling method for MMIC has been introduced. Parametric studies on the relations between the total gate width or the power dissipation and the thermal resistance were performed. With the parametric study results, an equation for calculating the thermal resistance of an MMIC showing error of 6% or less has been developed. © 2005 IEEE.
- KSP Keywords
- Finite Element Method(FEM), Gate Width, Ka-band communications, Microwave monolithic integrated circuits(MMIC), Modeling method, Numerical Analysis, Parametric study, Thermal Characteristics, Thermal Characterization, metal layer, microwave integrated circuit