BROWSE
Detail
Journal Article
Simultaneous Optical/Electrical Interconnection of Polymer Planar-Lightwave-Circuit Chip based on Polymer MOEMS and Replication Technology
Cited 8 time in 
Share 
Share
- Authors
- Jin Tae Kim, Choon Gi Choi
- Issue Date
- 2006-02
- Citation
- Sensors and Actuators A : Physical, v.126, no.2, pp.425-429
- ISSN
- 0924-4247
- Publisher
- Elsevier
- Language
- English
- Type
- Journal Article
- Abstract
- For simultaneous optical/electrical interconnection of a polymeric planar-lightwave-circuit (PLC) chip, a polymer micro-opto-electro-mechanical system (MOEMS)-based passive alignment method was designed and realized in thermosetting polymer using a UV imprinting technique. To reduce the steps for fabricating alignment structures, waveguide cores and micro-pedestals were formed at the same time with only one step of imprinting. By inserting the electrode-patterned micro-pedestals on the polymer PLC chip into the alignment pits of the silicon optical bench, optical/electrical interconnections were accomplished simultaneously and automatically. An assembled polymeric optical device shows a coupling loss of about 1.7 dB per coupling face and a good electrical interconnection at a wavelength of 1.5 μm. © 2005 Elsevier B.V. All rights reserved.
- KSP Keywords
- Alignment method, Coupling loss, Microoptoelectromechanical system(MOEMS), One-step, Optical devices, Polymer PLC, Silicon optical bench(SIOB), UV imprinting, alignment structures, electrical interconnections, imprinting technique