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Journal Article Normally-off GaN MIS-HEMT Using a Combination of Recessed-Gate Structure and CF4 Plasma Treatment
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Authors
Youngrak Park, Jungjin Kim, Woojin Chang, Dongyun Jung, Sungbum Bae, Jaekyung Mun, Chi-Hoon Jun, Sangchoon Ko, Eunsoo Nam
Issue Date
2015-05
Citation
Physica Status Solidi (A), v.2112, no.5, pp.1170-1173
ISSN
1862-6300
Publisher
Wiley-VCH Verlag GmbH
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1002/pssa.201431737
Abstract
The combination of a recessed-gate structure and CF4 plasma treatment was studied to realize a normally-off operation of a AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistor (MIS-HEMT) for power electronics applications. We verified that fluorine ions incorporated with a strong electronegativity increase the threshold voltage (Vth). In addition, CF4 plasma treatment slightly etches the AlGaN surface as deeply as 25 횇. A fabricated device exhibits a threshold voltage of as high as 2.6 V. Using a combination of gate recess and plasma treatment processes, the device demonstrates a tremendous potential of normally-off AlGaN/GaN MIS-HEMTs for power electronics applications.
KSP Keywords
As 2, Fluorine ions, GaN MIS-HEMT, Gate recess, High-electron mobility transistor(HEMT), Metal-insulator-semiconductor(MIS), Normally-Off, Power Electronics, plasma treatment, recessed gate, threshold voltage(Vth)