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Conference Paper
Thermal Analysis and Performance in 1.55um Bottom-Emitting InAlGaAs VCSELs with Dielectric Mirror, Flip-Chip Bonded on Si-Substrate
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- Issue Date
- 2006-07
- Citation
- International Conference on Optical Internet and Next Generation Network (COIN-NGNCON) 2006, pp.355-357
- Language
- English
- Type
- Conference Paper
- Abstract
- A novel structure of 1.55um bottom-emitting InAlGaAs VCSELs grown by single-step MOCVD has been thermally analyzed in simulation and measurement through active sizes, to be optimized the performances for the flip-chip bonded assembly on Si-substrate. ©2006 OSIA.
- KSP Keywords
- Bonded assembly, Simulation and measurement, Single step, Thermal Analysis, dielectric mirror, flip chip