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Journal Article N2-Annealing Effects on Characteristics of Schottky-Barrier MOSFETS
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Authors
Moon Gyu Jang, Yark Yeon Kim, Myung Sim Jeon, Chel Jong Choi, In Bok Baek, Seong Jae Lee, Byoung Chul Park
Issue Date
2006-08
Citation
IEEE Transactions on Electron Devices, v.53, no.8, pp.1821-1825
ISSN
0018-9383
Publisher
IEEE
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1109/TED.2006.876575
Abstract
Schottky-barrier (SB) heights of erbium and platinum silicides are evaluated using current-voltage and capacitance-voltage methods in the Schottky diodes. For the erbium-silicided Schottky diodes, the extracted SB heights show big differences depending on the extraction methods, due to the existence of the interface traps. The interface traps in the erbium silicide are efficiently cured by N2 annealing. Various sizes of the erbium/platinum-silicided n/p-type SB-MOSFETs are manufactured from 20 μm to 23 nm. Also, N2 annealing is applied to enhance the SB-MOSFETs' subthreshold characteristics by minimizing the interface-trap density. The manufactured SB-MOSFETs show a good drain-induced barrier thinning and subthreshold swing characteristics, due to the existence of a SB between the source and the channel, which indicates the possible application of the SB-MOSFETs in a nanoscale regime. © 2006 IEEE.