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Conference Paper
A Flip Chip Packaged InP HBT Transimpedance Amplifier for 40 Gb/s Optical Link Application
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- Authors
- Chul Won Ju, Jong Min Lee, Seong Il Kim, Byoung Gue Min, Kyung Ho Lee
- Issue Date
- 2006-08
- Citation
- International Symposium on the Physics of Semiconductors and Applications (ISPSA) 2006, pp.1-1
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- 40 gb/s, InP HBT, Transimpedance Amplifier(TIA), flip chip, optical link