ETRI-Knowledge Sharing Plaform

KOREAN
논문 검색
Type SCI
Year ~ Keyword

Detail

Conference Paper A Novel Packaging Method of Fully Passive Optical Alignment for Multi-Chennel Optical Interconnection Module
Cited 0 time in scopus Download 1 time Share share facebook twitter linkedin kakaostory
Authors
Kwon-Seob Lim, Hyun Seo Kang, Jae-Hyung Jang
Issue Date
2015-12
Citation
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) 2015, pp.156-158
Language
English
Type
Conference Paper
DOI
https://dx.doi.org/10.1109/EDAPS.2015.7383690
Project Code
15ZI2100, A Study on Development of ICT Technologies for Supporting Industries, Kang Hyun Seo
Abstract
In this paper, a novel packaging method of fully passive optical alignment and surface mounting for parallel optical interconnects modules has been developed for a high-capacity data transmission such as chip-to-chip and board-to-board interconnects within smart device and interconnects between devices.
KSP Keywords
Board-to-board, Data transmission, High-capacity, Optical Interconnect(OI), Optical interconnection module, Smart devices, Surface mounting, chip-to-chip, packaging method, passive optical alignment