BROWSE
Detail
Conference Paper
Development of the Micro CPL for a Thin Packaging Structure
Cited - time in 
Share 
Share
- Authors
- Seok Hwan Moon, Gunn Hwang, Byoung Gi Kim, Jeong Se Suh
- Issue Date
- 2006-09
- Citation
- International Heat Pipe Symposium (IHPS) 2006, pp.72-76
- Language
- English
- Type
- Conference Paper
- Abstract
- Electronic devices have been minimized but the performances of those becoming better and better. Electronic system engineers have being faced with a great challenge to the continuously reduced volume of the system and the increase of complexity and power density of them. Therefore it is needed to develop a new cooling method suitable for a thin packaging structure with high thermal density. As an alternative method a thin flat plate type micro CPL(capillary pumped loop) with less than 2mm thickness was developed in this study. Contrary to a micro heat pipe, the micro CPL has separated liquid line and vapor line so that it can transport heat to a long distance and dissipate large heat regardless of the position of the heat source. The proposed micro CPL has two staged grooves in evaporator instead of poles for preventing the backflow of working fluid and the simpler structure than that of the pole type. Also additional vapor space from evaporator to condenser is made on the upper substrate, therefore flow resistance of the vapor could be reduced. A numerical analysis was conducted to investigate the operating mechanism and the thermal characteristics of the micro CPL. The micro CPL was fabricated using MEMS technology. This micro CPL is divided into lower and upper substrate each. The lower substrate is made of silicon and the upper substrate Pyrex glass for visualization. Through a preliminary test it is checked that there is no leakage at the adhesion part between lower and upper substrates and at the bonding part between lower substrate and fill tube for working fluid. Pure distilled water was used as working fluid.
- KSP Keywords
- Alternative method, Capillary pumped loop, Cooling method, Distilled water, Electronic systems, Flat plate, Heat source, Long-distance, MEMS Technology, Micro heat pipe, Numerical Analysis