본 논문에서는 40 GHz 대역에서 동작하는 IEEE 802.16 고정 무선 통신을 위한 천이, 소형 TDD 송수신 모듈의 front-end 모듈을 설계하고 구현하는 방법을 제안한다. 제안된 모듈은 저손실과 소형화를 동시에 달성하기 위하여 캐비티 공정을 가지는 다층 LTCC 기술을 이용하여 제작되었다. 스위치의 입출력단에 와이어본드 정합회로의 설계 및 안테나와의 연결을 위한 도파관 천이 구조를 통해 저손실의 천이를 얻었으며, 기존 금속 도파관 필터를 대체한 유전체 도파관 필터를 사용함으로써 소형화를 달성하였다. 이를 구현하기 위해 유전율 7.1, 두께 100 um인 총 6층의 LTCC 기판을 사용하였으며 제작된 소형 front-end 모듈의 크기는 $30{\times}7{\times}0.8mm^3$이다. 그리고 송수신 삽입 손실 < 5.3 dB, 이미지 신호 제거 > 49 dB의 우수한 천이를 얻을 수 있었다.
KSP Keywords
Front-End, IEEE 802.16
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