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Two-Dimensional Optical Interconnection Based on Two-Layered Optical Printed Circuit Board
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- Authors
- Sung Hwan Hwang, Mu Hee Cho, Sae-Kyoung Kang, Tae-Woo Lee, Hyo-Hoon Park, Byung Sup Rho
- Issue Date
- 2007-03
- Citation
- IEEE Photonics Technology Letters, v.19, no.6, pp.411-413
- ISSN
- 1041-1135
- Publisher
- IEEE
- Language
- English
- Type
- Journal Article
- Abstract
- The demonstration of an optical platform based on an optical printed circuit board (OPCB) was shown for two-dimensional (2-D) chip-to-chip optical interconnection. The optical platform was designed for 96 Gb/s total throughput which was 2 layers × 4 channels × 4 parallel links × 3 Gb/s/ch and using a passive assembly technology. We fabricated three main components for the 2-D optical interconnection; two-layered six-channel fiber- and connector-embedded OPCB, two-layered six-channel 90째-bent fiber connectors, and 2-D optical transmitter/receiver (Tx/Rx) modules. The total optical loss from the Tx to the Rx was measured to approximately be -5.3 dB. The optical interconnection using an optical platform was successfully achieved with 3-Gb/s/ch data transmission. © 2007 IEEE.
- KSP Keywords
- Bent fiber, Chip-to-chip optical interconnection, Data transmission, Optical loss, Optical platform, Optical printed circuit board(OPCB), Optical transmitters, Passive assembly, assembly technology, printed circuit board(PCB), total throughput