상세정보
학술지
Two-Dimensional Optical Interconnection Based on Two-Layered Optical Printed Circuit Board
- 저자
- 황선환, 조무희, 강세경, 이태우, 박효훈, 노병섭
- 발행일
- 200703
- 출처
- IEEE Photonics Technology Letters, v.19 no.6, pp.411-413
- ISSN
- 1041-1135
- 출판사
- IEEE
- 협약과제
- 06MT2700, OTH기반 40G급 다중서비스 전송 기술개발, 고제수
- 초록
- The demonstration of an optical platform based on an optical printed circuit board (OPCB) was shown for two-dimensional (2-D) chip-to-chip optical interconnection. The optical platform was designed for 96 Gb/s total throughput which was 2 layers × 4 channels × 4 parallel links × 3 Gb/s/ch and using a passive assembly technology. We fabricated three main components for the 2-D optical interconnection; two-layered six-channel fiber- and connector-embedded OPCB, two-layered six-channel 90째-bent fiber connectors, and 2-D optical transmitter/receiver (Tx/Rx) modules. The total optical loss from the Tx to the Rx was measured to approximately be -5.3 dB. The optical interconnection using an optical platform was successfully achieved with 3-Gb/s/ch data transmission. © 2007 IEEE.
- KSP 제안 키워드
- Bent fiber, Chip-to-chip optical interconnection, Data transmission, Optical loss, Optical platform, Optical printed circuit board(OPCB), Optical transmitters, Passive assembly, assembly technology, printed circuit board(PCB), total throughput