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Conference Paper
Novel Process for the Electrodes of Microbolometer
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- Authors
- Ho Jun Ryu, Seong-Mok Cho, Woo Seok Yang, Sang Hoon Cheon, Byoung-Gon Yu
- Issue Date
- 2007-10
- Citation
- International Conference on Sensor Technologies and Applications (SENSORCOMM) 2007, pp.10-13
- Publisher
- IEEE
- Language
- English
- Type
- Conference Paper
- Abstract
- The electrodes for microbolometer it has been required to have low thermal conductivity, low electrical resistivity, and low stress for small deflection of microbolometer membrane. In this work we introduced the nickel-chrome alloy as an electrode for our designed microbolometer. To define an electrode on the membrane the etching process is indispensable. Using a dry etching technique there is a selectivity problem with underlayer of nickel-chrome alloy layer during etching process. The other hand there is a topological deterioration, which causes a bad effect for further planarizaiton process when we use wet process. We had fabricated the electrode of microbolometer using hybrid etching technique. Therefore we have successfully established the hybrid etching process for nickel-chrome alloy film which is used for the resistive microbolometer. © 2007 IEEE.
- KSP Keywords
- Alloy films, Alloy layer, Etching process, Etching technique, Low stress, Low thermal conductivity, Novel process, Wet process, dry etching, low electrical resistivity