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Conference Paper Chip-To-Chip Optical Link By Using Optical Wiring Method
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Authors
In-Kui Cho, Seoung Ho Ahn, Myung-Yung Jeong, Byung Sup Rho, Hyo Hoon Park
Issue Date
2008-12
Citation
Photonics: Design, Technology, and Packaging III (SPIE 6801), v.6801, pp.1-8
Language
English
Type
Conference Paper
DOI
https://dx.doi.org/10.1117/12.770816
Project Code
07MR1800, Development of Broadband RF Antenna Measurement Technology Standardization, Yun Je Hoon
Abstract
A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy assembly. This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the following steps: (a) forming a light source device, an optical detection device, and an optical transmission unit on a substrate (metal optical bench (MOB)); (b) preparing a flexible optical transmission-connection medium (optical wiring link) to optically connect the light source device formed on the substrate with the optical detection device; and (c) directly connecting one end of the surface-finished optical transmission connection medium with the light source device and the other end with the optical detection device. A chip-to-chip optical link system constructed with TRx modules was fabricated and the optical characteristics were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust and cost-effective assembly for vertical-cavity surface-emitting lasers (VCSELs) and photodiodes (PDs). We successfully achieved a 5 Gb/s data transmission rate with this optical link.
KSP Keywords
Data transmission rate, Light sources, Optical characteristics, Optical detection, Optical interconnection, Wiring method, chip-to-chip, cost-effective, detection device, optical link, optical transmission