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Journal Article
Surface-micromachined MEMS acoustic sensor with bottom electrode anchors
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- Issue Date
- 2008-04
- Citation
- Electronics Letters, v.44, no.9, pp.1-2
- ISSN
- 0013-5194
- Publisher
- IET
- Language
- English
- Type
- Journal Article
- Abstract
- A capacitive MEMS acoustic sensor with two sacrificial layers based on surface micromachining on a GaAs substrate is presented. This sensor has bottom electrode anchors fabricated using an initial sacrificial layer for the formation of a back chamber. The bottom anchors serve to eliminate the back side process of the wafer for a conventional back chamber because the chamber is implemented through substrate surface etching. The proposed circular-type microphone has a diameter of 1.0mm and a gap height of 2m. It shows a pull down voltage of 8.5V and a total capacitance of 5.5pF. Additionally, the MEMS microphone has a sensitivity of 0.09mV/Pa at 1kHz at a bias of 2V. © The Institution of Engineering and Technology 2008.
- KSP Keywords
- Acoustic Sensor, Bottom electrode, Capacitive MEMS, Circular-type, GaAs substrates, Gap height, MEMS Microphone, Sacrificial layer, Substrate surface, surface etching, surface micromachining