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Journal Article Vanadium Dioxide Films Deposited on Amorphous SiO2- and Al2O3-Coated Si Substrates by Reactive RF-Magnetron Sputter Deposition
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Authors
Sun Jin Yun, Jung Wook Lim, Jong-Su Noh, Byung-Gyu Chae, Hyun-Tak Kim
Issue Date
2008-04
Citation
Japanese Journal of Applied Physics, v.47 no.4, pp.3067-3069
ISSN
0021-4922
Publisher
Japan Society of Applied Physics (JSAP), Institute of Physics (IOP)
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1143/JJAP.47.3067
Project Code
08MB3100, New electronic device using electric current jump, Hyun-Tak Kim
Abstract
VO2 films showing abrupt metal-insulator transition (MIT) were fabricated on amorphous-film-coated Si wafers by reactive RF-magnetron sputter deposition using a V-metal target, and postdeposition annealing. The amorphous films were thermally grown SiO2 or Al2O3 films deposited by low-temperature plasma-enhanced atomic layer deposition. The effects of the underlayer and chamber pressure governing oxidation ambient on MIT characteristics were investigated. The MIT of VO2 films deposited at 5 mTorr on SiO2 and Al2O3 induced resistance changes of 1.3 × 104 and 2.3 × 103, respectively. The resistance change due to MIT was larger than 6.3 × 103 in an operating pressure range as wide as 5-25 mTorr on SiO 2. © 2008 The Japan Society of Applied Physics.
KSP Keywords
Amorphous films, Applied physics, Chamber pressure, Induced resistance, Low temperature(LT), Operating Pressure, Postdeposition annealing(PDA), Pressure range, RF-magnetron sputter deposition, Resistance change, Si substrate