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학술지 Bottom-Inlet-Type Micro-Electro-Mechanical System Acoustic Sensors Based on Two Polyimide/Amorphous-Si Sacrificial Layers
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저자
이재우, 제창한, 김이경, 이성규, 양우석, 이상국
발행일
201412
출처
IET Micro & Nano Letters, v.9 no.12, pp.845-849
ISSN
1750-0443
출판사
IET
DOI
https://dx.doi.org/10.1049/mnl.2014.0381
협약과제
14MB1600, 스마트&그린 빌딩용 자가충전 지능형 센서노드 플랫폼 핵심기술 개발, 권종기
초록
A bottom-inlet-type micro-electro-mechanical system acoustic sensor based on two polyimide/a-Si sacrificial layers is presented. A diaphragm was adapted to be on the top side of the sacrificial layers, showing the bottom-inlet structure for the package, which has the sensitivity of more than 3 dB compared with that of the top-inlet type. Also, the fundamental CMOS process implemented with Al electrodes was applied to have simple releasing steps by O2 ashing and XeF2 isotropic etching because of their material etching selectivity. The sensor module had a sensitivity of-38.9 dBV/Pa at 1 kHz with a bias of 9.2 V in the sweep range from 100 Hz to 16 kHz. In addition, to evaluate the opencircuit sensitivity, structure-based equivalent circuit modelling was performed with lumped parameters. The modelled sensitivity was in good agreement with the measured sensitivity in the error rate of 4.3% under 8 kHz, demonstrating the validity of the modelling. The modelled open-circuit sensitivity was determined to be-37.2 dBV/Pa at 1 kHz using the proposed lumped model.
KSP 제안 키워드
A-Si, Acoustic Sensor, Al electrodes, CMOS Process, Equivalent circuit modelling, Etching selectivity, Inlet structure, Inlet type, Isotropic etching, Lumped parameters, Micro-electro-mechanical system(MEMS)