상세정보
학술지
Optical Interconnection Platform Composed of Fiber-Embedded Board, 90˚-Bent Fiber Block, and 10-Gb/s Optical Module
- 저자
- 황성환, 조무희, 강세경, 조한서, 이태우, 박효훈
- 발행일
- 200806
- 출처
- IEEE/OSA Journal of Lightwave Technology, v.26 no.11, pp.1479-1485
- ISSN
- 0733-8724
- 출판사
- IEEE, OSA
- 협약과제
- 07MT2400, OTH기반 40G급 다중서비스 전송 기술개발, 고제수
- 초록
- An architecture of a passively assembled optical platform is suggested for a chip-to-chip optical interconnection system. The platform is constructed using all-fiber media for the optical paths: a fiber-embedded optical printed-circuit board (OPCB) and 90째-bent fiber connector. The passive assembling was achieved by employing the guide pins/holes of commercialized ferrules in the optical link between the OPCB, 90째-bent fiber connector, and the transmitter/receiver (Tx/ Rx) module. From this interconnection scheme, a low total optical loss of -5.3 dB was obtained. From an assembled platform with 10 Gb/s/ch × 4 ch Tx/Rx modules, a 7-Gb/s/ch data transmission was demonstrated with a bit error rate below 10-12, involving the optical and electrical crosstalk arisen in the whole channel operation. © 2008 IEEE.
- KSP 제안 키워드
- All-fiber, Bent fiber, Bit Error Rate(And BER), Chip-to-chip optical interconnection, Data transmission, Embedded board, Optical loss, Optical module, Optical platform, electrical crosstalk, fiber connector