상세정보
학술지
Interdevice Isolation Characteristics for Design and Fabrication of 60-GHz WPAN SoCs
- 발행일
- 200806
- 출처
- Microwave and Optical Technology Letters, v.50 no.6, pp.1699-1702
- ISSN
- 0895-2477
- 출판사
- John Wiley & Sons
- 협약과제
- 07MB1400, THz파 발진 변환 검출기 및 신호원, 강광용
- 초록
- The high interdevice isolation levels is one of the key technologies in the design and fabrication of 60-GHz WPAN SoC. To obtain proper interdevice isolation levels, we have analyzed and measured substrate coupling effects with various isolation techniques like a trench and implant structure. From the analyzed and measured results, the feasibility of the implant has confirmed to be applicable to the mm-wave SoC, and also derived an equivalent circuit form these results, which can be helpful to the design and fabrication of the 60-GHz WPAN SoC. © 2008 Wiley Periodicals, Inc.
- KSP 제안 키워드
- 60 GHz, Coupling effects, Design and fabrication, Equivalent Circuit, Interdevice isolation, Isolation technique, Key technology, millimeter wave(mmWave), substrate coupling