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Interdevice isolation characteristics for design and fabrication of 60‐GHz WPAN SoCs
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- Authors
- Sung Il Kim, Chul-Wook Lee, Suck-Won Yun, Kwang-Yong Kang, Hai-Young Lee
- Issue Date
- 2008-06
- Citation
- Microwave and Optical Technology Letters, v.50, no.6, pp.1699-1702
- ISSN
- 0895-2477
- Publisher
- John Wiley & Sons
- Language
- English
- Type
- Journal Article
- Abstract
- The high interdevice isolation levels is one of the key technologies in the design and fabrication of 60-GHz WPAN SoC. To obtain proper interdevice isolation levels, we have analyzed and measured substrate coupling effects with various isolation techniques like a trench and implant structure. From the analyzed and measured results, the feasibility of the implant has confirmed to be applicable to the mm-wave SoC, and also derived an equivalent circuit form these results, which can be helpful to the design and fabrication of the 60-GHz WPAN SoC. © 2008 Wiley Periodicals, Inc.
- KSP Keywords
- 60 GHz, Coupling effects, Design and fabrication, Equivalent Circuit, Interdevice isolation, Isolation technique, Key technology, millimeter wave(mmWave), substrate coupling