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Journal Article Interdevice Isolation Characteristics for Design and Fabrication of 60-GHz WPAN SoCs
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Authors
Sung Il Kim, Chul-Wook Lee, Suck-Won Yun, Kwang-Yong Kang, Hai-Young Lee
Issue Date
2008-06
Citation
Microwave and Optical Technology Letters, v.50, no.6, pp.1699-1702
ISSN
0895-2477
Publisher
John Wiley & Sons
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1002/mop.23470
Project Code
07MB1400, Development of THz-wave oscillation/modulation/detection module and signal sources technology, Kang Kwang-Yong
Abstract
The high interdevice isolation levels is one of the key technologies in the design and fabrication of 60-GHz WPAN SoC. To obtain proper interdevice isolation levels, we have analyzed and measured substrate coupling effects with various isolation techniques like a trench and implant structure. From the analyzed and measured results, the feasibility of the implant has confirmed to be applicable to the mm-wave SoC, and also derived an equivalent circuit form these results, which can be helpful to the design and fabrication of the 60-GHz WPAN SoC. © 2008 Wiley Periodicals, Inc.
KSP Keywords
60 GHz, Coupling effects, Design and fabrication, Equivalent Circuit, Interdevice isolation, Isolation technique, Key technology, millimeter wave(mmWave), substrate coupling