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학술지 New Fabrication of a Strained Si/Si1_yGey Dual Channel on a Relaxed Si1_xGex Virtual Substrate using a Ge-rich Layer Formed by Oxidation
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김상훈, 배현철, 이상흥
Applied Surface Science, v.254 no.19, pp.6025-6029
Elsevier Science, Elsevier
This paper presents a new method of forming a Si/SiGe dual channel on a Si 0.8 Ge 0.2 virtual substrate. Generally, in a CMOS process using a Si/SiGe dual channel, due to several processes involving ion-implantation, annealing and dry-etching after the deposition of the Si/SiGe dual channel, the surface can be damaged, leading to reduced electrical properties. However, if the dual channel is formed during a specific stage of the CMOS process, the defects of the dual channel can be reduced and the thermal stability will be excellent. Therefore, in this paper, a method for minimizing the defects of the dual channel is presented. This method uses the segregation of the Ge in the oxidation process of a SiGe. A Si/SiGe dual channel formed using this method achieved results that were identical to a dual channel deposited using the chemical vapor deposition (CVD) method. © 2008 Elsevier B.V. All rights reserved.
KSP 제안 키워드
CMOS Process, Chemical Vapor Deposition, Ion implantation, Oxidation process, Strained-Si, Thermal stability(TGA), Virtual substrate, dry etching, dual-channel, electrical properties(I-V curve), new method