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Journal Article Interchip Link System using an Optical Wiring Method
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Authors
In-Kui Cho, Jin-Hwa Ryu, Myung-Yung Jeong
Issue Date
2008-08
Citation
Optics Letters, v.33, no.16, pp.1881-1883
ISSN
0146-9592
Publisher
Optical Society of America(OSA)
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1364/OL.33.001881
Abstract
A chip-scale optical link system is presented with a transmitter/receiver and optical wire link. The interchip link system consists of a metal optical bench, a printed circuit board module, a driver/receiver integrated circuit, a vertical cavity surface-emitting laser/photodiode array, and an optical wire link composed of plastic optical fibers (POFs). We have developed a downsized POF and an optical wiring method that allows on-site installation with a simple annealing as optical wiring technologies for achieving high-density optical interchip interconnection within such devices. Successful data transfer measurements are presented. © 2008 Optical Society of America.