ETRI-Knowledge Sharing Plaform

ENGLISH

성과물

논문 검색
구분 SCI
연도 ~ 키워드

상세정보

학술지 Interchip Link System using an Optical Wiring Method
Cited 10 time in scopus Download 0 time Share share facebook twitter linkedin kakaostory
저자
조인귀, 류진화, 정명영
발행일
200808
출처
Optics Letters, v.33 no.16, pp.1881-1883
ISSN
0146-9592
출판사
Optical Society of America(OSA)
DOI
https://dx.doi.org/10.1364/OL.33.001881
협약과제
08MR1400, 광대역 RF안테나 측정기술 표준개발, 조인귀
초록
A chip-scale optical link system is presented with a transmitter/receiver and optical wire link. The interchip link system consists of a metal optical bench, a printed circuit board module, a driver/receiver integrated circuit, a vertical cavity surface-emitting laser/photodiode array, and an optical wire link composed of plastic optical fibers (POFs). We have developed a downsized POF and an optical wiring method that allows on-site installation with a simple annealing as optical wiring technologies for achieving high-density optical interchip interconnection within such devices. Successful data transfer measurements are presented. © 2008 Optical Society of America.
KSP 제안 키워드
Data transfer, High-density, Integrated circuit, On-site installation, Photodiode array, Wiring method, optical link, plastic optical fiber, printed circuit board(PCB), vertical-cavity surface-emitting laser(VCSEL)