상세정보
학술지
Chip-to-chip Optical Interconnect using Gold Long-range Surface Plasmon Polariton Waveguides
- 발행일
- 200808
- 출처
- Optics Express, v.16 no.17, pp.13133-13138
- ISSN
- 1094-4087
- 출판사
- Optical Society of America(OSA)
- 협약과제
- 08MB2200, 휴대 단말기용 나노 플렉시블 광전배선 모듈, 주정진
- 초록
- We demonstrate a novel on-board chip-to-chip optical interconnect using long-range surface plasmon polariton (LR-SPP) waveguides that feature 2.5-cm-long gold strips embedded in a low loss polymer cladding. A TM-mode vertical-cavity surface-emitting laser (VCSEL) operating at a wavelength of 1.3 μm was butt-coupled into the waveguides in order to excite a fundamental LR-SPP mode and then the transmitted light was received with a photo-diode (PD). The waveguide width is varied in the range of 1.5-5.0 μm in order to optimize the insertion loss where the 3-μm-wide waveguide provides a minimum insertion loss of -17 dB, consisting of 6 dB/cm propagation loss and 2 dB coupling loss. An interconnect system based on the optimized waveguide with a 4-channel array is assembled with the arrayed optoelectronic chips. It shows the feasibility of 10 Gbps (2.5 Gbps × 4 channels) signal transmission indicating that the LR-SPP waveguide is a potential transmission line for optical interconnection. © 2008 Optical Society of America.
- KSP 제안 키워드
- Coupling loss, Long-range surface plasmon, Low loss polymer, On-board, Optical Interconnect(OI), Optical interconnection, Photo diode, Polymer cladding, Propagation loss, Signal transmission, Surface plasmon(SP)