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Journal Article Investigation of the Effect of Calcination Temperature on HMDS-treated Ordered Mesoporous Silica Film
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Authors
Tae-Jung Ha, Hyung-Ho Park, Sang-Bae Jung, Ho Jun Ryu, Byoung-Gon Yu
Issue Date
2008-10
Citation
Journal of Colloid and Interface Science, v.326, no.1, pp.186-190
ISSN
0021-9797
Publisher
Elsevier
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1016/j.jcis.2008.07.024
Project Code
08MB1900, Development of CMOS based MEMS processed multi-functional sensor for ubiquitous environment, Chang Auck Choi
Abstract
To reduce signal delay in ultra-large-scale integrated circuits, an intermetal dielectric with low dielectric constant is required. Ordered mesoporous silica film is appropriate for use as an intermetal dielectric due to its low dielectric constant and superior mechanical properties. To reduce the dielectric constant, an ordered mesoporous silica film prepared by a tetraethoxysilane/methyltriethoxysilane silica precursor and Brij-76 block copolymer was surface-modified by hexamethyldisilazane (HMDS) treatment. HMDS treatment substituted {single bond}OH with {single bond}Si(CH3)3 groups on the silica surface. After treatment, ordered mesoporous silica films were calcined at various calcination temperatures, and the calcination temperature to obtain optimal structural, electrical, and mechanical properties was determined to be approximately 300 °C. © 2008 Elsevier Inc. All rights reserved.
KSP Keywords
After treatment, Brij-76, Calcination temperature, Intermetal dielectric(IMD), Low dielectric constant, Mechanical properties(PMCs), Ordered mesoporous silica film, Signal delay, Surface-modified, Ultra-large-scale integrated circuits, block copolymer