08MB3500, A Smart Eye based on Convergence SoC,
Cho Han Jin
Abstract
SiP(System-in-Package)는 하나의 단위로 패키징하여 시스템이나 서브 시스템과 연관된 다기능을 수행하도록 한, 서로 다른 기능의 능동 전자 부품들의 조합이다. SiP는 초경량, 초소형 부품 혹은 시스템 개발이라는 모바일 시대의 키워드를 구현할 수 있을 뿐만 아니라 패키징이나 보드 레벨에서 시스템의 성능을 떨어뜨리는 요인을 제거하여 부품이나 시스템의 성능을 최적화할 수 있는 이점을 제공하기 때문에 이에 대한 관심이 증대되고 있다. 본 고에서는 국내외 삼차원 SiP 기술 동향을 MCP(Multichip Package), BoB(Board-on-Board), 실리콘 기반 삼차원 SiP로 나누어 설명하고 시장에서 어느 정도 성공을 거둔 MCP, 삼차원 시스템의 기술적인 가능성을 보여준 BoB 기술개발 사례를 참고하여 실리콘 기반 삼차원 SiP가 시장에서 경쟁력을 갖기 위해서 넘어야 할 과제와 그에 대한 해결책을 모색해 보고자 한다.
KSP Keywords
3D SiP, On-board, System in package(SIP)
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