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Journal Article Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder
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Authors
Eom Yong Sung, 장건수, Moon Jong Tae, 남재도, 김종민
Issue Date
200811
Source
Microelectronic Engineering, v.85 no.11, pp.2202-2206
ISSN
0167-9317
Publisher
Elsevier
DOI
https://dx.doi.org/10.1016/j.mee.2008.05.038
Project Code
08MB3300, 차세대 ACF 소재 및 공정기술 개발, Eom Yong Sung
Abstract
For the highly reliable interconnection in a micro-packaging technology requiring an excellent electrical and mechanical performance, the new anisotropic conductive adhesive (ACA) system with a low melting point solder was designed and characterized. An optimum flip-chip bonding cycle considering the chemo-rheological properties of a polymer matrix and solder was proposed. The bonding mechanism of the new ACA system was experimentally observed by the optical microscope. The electrical properties such as electrical resistance of about 5.6 m廓 and current density of 10,000 A/cm2 were measured by the 4-point probe test. The measured shear strength was 304 MPa after bonding process. Electrical and mechanical performances were measured and compared before and after a pressure cooker test (PCT). In order to get a more stable ACA system during processing, the polymer matrix mixed with a reductant and a low melting point solder powder will be continuously developed in the near future. © 2008 Elsevier B.V. All rights reserved.
KSP Keywords
4-Point probe, Bonding process, Electrical Resistance, Flip-chip bonding, Low melting point, Mechanical characterization, Mechanical performance, Optical microscope, Packaging technology, Probe test, Rheological property