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Conference Paper Novel Micro Capacitive Inclinometer with Oblique Comb Electrode and Suspension Spring Aligned Parallel to {111} Vertical Planes of (110) Silicon
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Authors
Dae Hun Jeong, Sung Sik Yun, Myung Lae Lee, Gunn Hwang, Chang Auk Choi, Jong Hyun Lee
Issue Date
2009-01
Citation
International Conference on Micro Electro Mechanical Systems (MEMS) 2009, pp.797-800
Publisher
IEEE
Language
English
Type
Conference Paper
DOI
https://dx.doi.org/10.1109/MEMSYS.2009.4805503
Abstract
A novel high resolution micro capacitive inclinometer has been developed using (110) silicon. KOH crystalline wet etching was employed after silicon deep reactive ion etching (DRIE) to reduce mo hologic defects on the sidewalls of oblique comb electrodes aligned parallel to vertical {111 plane. Suspension springs are also parallel to other vertical { 111 } plane to secure the width during KOH wet etching. The sensitivity (pF/째) was increased because the oblique comb electrodes change both the overlapped area and gap during operation. The capacitance changed from -0.8 to 0.8 pF for -90째-90째 and resolution was estimated at 0.18째 or less for 짹80째. ©2009 IEEE.
KSP Keywords
Deep reactive ion etching, High resolution, KOH wet etching, Suspension spring, comb electrodes