상세정보
학술지
Design and Fabrication of 1.25-Gb/s Full-Triplex Transceiver Module With PLC on a Lossy Si Substrate for G/E-PONs
- 발행일
- 200903
- 출처
- Journal of Lightwave Technology, v.27 no.6, pp.679-687
- ISSN
- 0733-8724
- 출판사
- IEEE
- 협약과제
- 08MB1500, THz파 발진 변환 검출기 및 신호원, 강광용
- 초록
- 1.25 Gb/s optoelectronic full-triplex transceiver module with planar-lightwave-circuits was designed and fabricated for the fiber-to-the-home services according to G/E-PONs standards. A low electrical crosstalk of the critical characteristics for the reliable operation of the 1.25 Gb/s full-triplex transceiver module is intensively investigated because the electrical crosstalk on a resistive silicon substrate is more serious than that on a dielectric substrate. It is observed that the performances of the transmitter and receiver satisfy the transmitter and receiver specifications defined in the standards. From this proposed module layout, a design convenience as well as a great reduction of the silicon substrate size by about 50 % was completely achieved. Consequently, the 1.25 Gb/s full-triplex transceiver module was fabricated with electrical and mechanical packaging technologies such of a low crosstalk design and a passive alignment method. © 2009 IEEE.
- KSP 제안 키워드
- Alignment method, Design and fabrication, Dielectric substrate, Low crosstalk, Si substrate, Silicon substrate, Transmitter and receiver, critical characteristics, electrical crosstalk, fiber to the home(FTTH), passive alignment