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Design and Fabrication of 1.25-Gb/s Full-Triplex Transceiver Module With PLC on a Lossy Si Substrate for G/E-PONs
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- Authors
- Sung Il Kim, Yong Sung Eom, Chul Wook Lee, Yong Soon Baek, Jong Tae Moon, Kwang Yong Kang, Hai Young Lee
- Issue Date
- 2009-03
- Citation
- Journal of Lightwave Technology, v.27, no.6, pp.679-687
- ISSN
- 0733-8724
- Publisher
- IEEE
- Language
- English
- Type
- Journal Article
- Abstract
- 1.25 Gb/s optoelectronic full-triplex transceiver module with planar-lightwave-circuits was designed and fabricated for the fiber-to-the-home services according to G/E-PONs standards. A low electrical crosstalk of the critical characteristics for the reliable operation of the 1.25 Gb/s full-triplex transceiver module is intensively investigated because the electrical crosstalk on a resistive silicon substrate is more serious than that on a dielectric substrate. It is observed that the performances of the transmitter and receiver satisfy the transmitter and receiver specifications defined in the standards. From this proposed module layout, a design convenience as well as a great reduction of the silicon substrate size by about 50 % was completely achieved. Consequently, the 1.25 Gb/s full-triplex transceiver module was fabricated with electrical and mechanical packaging technologies such of a low crosstalk design and a passive alignment method. © 2009 IEEE.
- KSP Keywords
- Alignment method, Design and fabrication, Dielectric substrate, Electrical crosstalk, Fiber to the Home(FTTH), Low crosstalk, Si substrate, Silicon substrate, Transmitter and receiver, critical characteristics, passive alignment