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Journal Article
Kinetics of Chemical Changes in Phenol Formaldehyde Based Polymeric Films Etched in N2 O and O2 Inductively Coupled Plasmas: A Comparative Study
- Authors
- Kwang Ho Kwon, Nam Ki Min, Seung Youl Kang, Kyu Ha Baek, Kyung Soo Suh, Dmitriy Alexandrovich Shutov
- Issue Date
- 2009-09
- Citation
- Japanese Journal of Applied Physics, v.48 no.8, pp.1-4
- ISSN
- 0021-4922
- Publisher
- Japan Society of Applied Physics (JSAP), Institute of Physics (IOP)
- Language
- English
- Type
- Journal Article
- Project Code
- 08IB3500, 인쇄 소재의 TFT 특성 연구, Baek Kyu-Ha
- Abstract
- This paper reports on investigation of surface chemistry and etch rates of phenol formaldehyde based polymer after N2O and O2 radio frequency (RF) inductively coupled plasma processing depend on exposure time. By using X-ray photoelectron spectroscopy, it was shown that oxygen and nitrogen oxide plasma expositions both lead to similar changes in the chemical composition of polymer. The nitrogen oxide plasma does not lead to any significant increase of concentration of nitrogen-containing groups on the polymer. It was confirmed that the mechanism of photoresist destruction in the N2O discharge was generally identical to that in the O2 plasma. Furthermore, the surface interactions with the polymer of nitrogen-containing active species could be neglected. © 2009 The Japan Society of Applied Physics.
- KSP Keywords
- Applied physics, Chemical changes, Etch rates, Exposure time, Inductively-coupled plasma(ICP), Nitrogen oxide, Nitrogen-containing, O and O, Polymeric films, Surface chemistry, X-ray Photoelectron Spectroscopy