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Electrohydrodynamic Micropatterning of Silver Ink using Near-Field Electrohydrodynamic Jet Printing with Tilted-Outlet Nozzle
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- Authors
- Doo Hyeb Youn, Seong Hyun Kim, Yong Suk Yang, Sang Chul Lim, Seong Jin Kim, Su Han Ahn, Hyo Sun Sim, Seung Myoung Ryu, Dong Wook Shin, Ji Beom Yoo
- Issue Date
- 2009-10
- Citation
- Applied Physics A : Materials Science & Processing, v.96, no.4, pp.933-938
- ISSN
- 0947-8396
- Publisher
- Springer
- Language
- English
- Type
- Journal Article
- Abstract
- This paper introduces for the first time near-field electrohydrodynamic jet printing with tilted-outlet nozzle to obtain the fine and highly conductive patterns of silver (Ag) ink. Line widths produced by near-field electrohydrodynamic jet printing are less than 6 μm, which is approximately twenty times smaller than that of inkjet printing. Under optimized Ag ink annealing ranges 3-9 min for 30 wt% at 150°C, we observed Ag line pattern resistivities as low as 7×10-6 廓 cm. Ag ink conduction mechanisms were brought to light from microstructure analysis and post-thermal-annealing examination of electrical characteristics. © 2009 Springer-Verlag.
- KSP Keywords
- Ag ink, Electrohydrodynamic jet printing, Microstructure analysis, conduction mechanism, electrical characteristics, highly conductive, inkjet printing, line pattern, near-field, silver ink