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Journal Article Electrohydrodynamic Micropatterning of Silver Ink using Near-Field Electrohydrodynamic Jet Printing with Tilted-Outlet Nozzle
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Authors
Doo Hyeb Youn, Seong Hyun Kim, Yong Suk Yang, Sang Chul Lim, Seong Jin Kim, Su Han Ahn, Hyo Sun Sim, Seung Myoung Ryu, Dong Wook Shin, Ji Beom Yoo
Issue Date
2009-10
Citation
Applied Physics A : Materials Science & Processing, v.96, no.4, pp.933-938
ISSN
0947-8396
Publisher
Springer
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1007/s00339-009-5262-7
Abstract
This paper introduces for the first time near-field electrohydrodynamic jet printing with tilted-outlet nozzle to obtain the fine and highly conductive patterns of silver (Ag) ink. Line widths produced by near-field electrohydrodynamic jet printing are less than 6 μm, which is approximately twenty times smaller than that of inkjet printing. Under optimized Ag ink annealing ranges 3-9 min for 30 wt% at 150°C, we observed Ag line pattern resistivities as low as 7×10-6 廓 cm. Ag ink conduction mechanisms were brought to light from microstructure analysis and post-thermal-annealing examination of electrical characteristics. © 2009 Springer-Verlag.
KSP Keywords
Ag ink, Electrohydrodynamic jet printing, Microstructure analysis, conduction mechanism, electrical characteristics, highly conductive, inkjet printing, line pattern, near-field, silver ink