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Journal Article
Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing
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- Authors
- Keon Soo Jang, Yong Sung Eom, Jong Tae Moon, Yong Soo Oh, Jae Do Nam
- Issue Date
- 2009-12
- Citation
- Journal of Nanoscience and Nanotechnology, v.9, no.12, pp.7461-7466
- ISSN
- 1533-4880
- Publisher
- American Scientific Publishers (ASP)
- Language
- English
- Type
- Journal Article
- Project Code
- 09MB4300, Hybrid underfill material for an electrical interconnection and high adhesion strength, Eom Yong Sung
- Abstract
- In this paper, we report the catalytic activity of the Sn/Bi alloy beads and its acceleration of the exothermic epoxy curing reactions in various thermal conditions and bead compositions. As being used as low-melting solder balls in electronic interconnection processes with various epoxy systems, it was found that the Sn/Bi beads substantially lowered the exothermic peak temperature of the diglycidyl ether of bisphenol A (DGEBA)/anhydride systems in up to ca. 140 °C depending on different types of anhydride curing agents. The catalytic activation of Sn/Bi powder was initiated with a small amount of Sn/Bi powder, for example, lowering ca. 50 °C of the exothermic peak temperature by adding only 0.1 vol% of Sn/Bi powder. The catalytic capability of the powder was increased by using smaller sized beads corresponding to larger catalytic surface area at the same volume fraction. Exhibiting a latent catalytic effect, the catalytic activity of Sn/Bi powder was remained latent at temperatures lower than 100 °C in isothermal conditions. © 2009 American Scientific Publishers. All rights reserved.
- KSP Keywords
- Catalytic activation, Catalytic behavior, Catalytic capability, Curing reactions, Epoxy curing, Low melting, Peak temperature, Solder ball, Surface Area, Volume fraction, catalytic activity