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학술지
Development of High-Quality LTCC Solenoid Inductor using Solder Ball and Air Cavity for 3-D SiP
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- 발행일
- 200912
- 출처
- 한국마이크로전자 및 패키징학회지, v.46 no.4, pp.5-8
- ISSN
- 1226-9360
- 출판사
- 한국마이크로전자 및 패키징학회지
- 협약과제
- 09MB1200, MEMS 패키지 기술 개발, 문종태
- 초록
- In this paper, a high-quality low-temperature co-fired ceramic (LTCC) solenoid inductor using a solder ball and an air cavity on a silicon wafer for three-dimensional (3-D) system-in-package (SiP) is proposed. The LTCC multilayer solenoid inductor is attached using Ag paste and solder ball on a silicon wafer with the air cavity structure. The air cavity is formed on a silicon wafer through an anisotropic wet-etching technology and is able to isolate the LTCC dielectric loss which is equivalent to a low k material effect. The electrical coupling between the metal layer and the LTCC dielectric layer is decreased by adopting the air cavity. The LTCC solenoid inductor using the solder ball and the air cavity on silicon wafer has an improved Q factor and self-resonant frequency (SRF) by reducing the LTCC dielectric resistance and parasitic capacitance. Also, 3-D device stacking technologies provide an effective path to the miniaturization of electronic systems.
- KSP 제안 키워드
- Ag paste, Air cavity, Cavity structure, Electrical Coupling, Electronic systems, High-quality, Low Temperature Cofired Ceramic(LTCC), Low temperature(LT), Material effect, Parasitic Capacitance, Quality-factor(Q-factor)