BROWSE
Detail
Conference Paper
Fabrication and Characteristics of Via-Hole Interconnections by an Inkjet Printing Method
Cited - time in 
Share 
Share
- Authors
- Yong Suk Yang, In Kyu You, Jae Bon Koo, Sang Seok Lee, Sang Chul Lim, Seong Youl Kang, Yong Young Noh
- Issue Date
- 2009-12
- Citation
- International Conference on Advanced Materials and Devices (ICAMD) 2009, pp.1-1
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- Inkjet printing, Printing method, Via-hole