BROWSE
Detail
Journal Article
Nonstick, Modulus‐Tunable and Gas‐Permeable Replicas for Mold‐Based, High‐Resolution Nanolithography
Cited 12 time in 
Share 
Share
- Authors
- Bong Kuk Lee, Hyunmin Cho, Bong Hyun Chung
- Issue Date
- 2011-10
- Citation
- Advanced Functional Materials, v.21, no.19, pp.3681-3689
- ISSN
- 1616-301X
- Publisher
- John Wiley & Sons
- Language
- English
- Type
- Journal Article
- Abstract
- A fundamental approach to fabricating a nonstick replica mold with high performance for the manufacturing of high-resolution nanostructures using mold-based lithography is presented. Low-viscosity liquid blends consisting of methacrylate multi-functionalized silsesquioxane (SSQMA), difunctional acrylics, and a small amount of silicone diacrylate (Si-DA) with low surface tension were used as nonstick replica-mold materials. The cured SSQMA/acrylic/Si-DA networks showed a high resistance to organic solvents (<1.2 wt.%), high UV transparency (>90% at 365 nm), hydrophobicity (water contact angle >90째), high modulus and wide-range modulus tunability (0.6-4.42 GPa) and small shrinkage (<3% in height). The mold materials with a nonstick property conferred by Si-DA possessed the ability to form sub-25-nm features with a high line-to-space ratio (1:1) and a high aspect ratio (4:1). In addition, a sufficiently cured replica mold with a low concentration of residual, uncross-linked (meth)acrylates was able to successfully replicate sub-25-nm features with a high line-to-space ratio (1:1) and a high aspect ratio (4:1), even if the release agent was not modified. Furthermore, replica molds can potentially be used to fabricate patterns free of bubble defects because of sufficient gas permeability. © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
- KSP Keywords
- 65 nm, Bubble defects, Co. KGaA, Contact angle(CA), Gas permeability, High aspect ratio, High modulus, High performance, High resistance, High-resolution, Low concentration