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Journal Article
Low-Voltage High-Performance Silicon Photonic Devices and Photonic Integrated Circuits Operating up to 30 Gb/s
- Authors
- Gyungock Kim, Jeong Woo Park, In Gyoo Kim, Sanghoon Kim, Sanggi Kim, Jong Moo Lee, Gun Sik Park, Jiho Joo, Ki-Seok Jang, Jin Hyuk Oh, Sun Ae Kim, Jong Hoon Kim, Jun Young Lee, Jong Moon Park, Do-Won Kim, Deog-Kyoon Jeong, Moon-Sang Hwang, Jeong-Kyoum Kim, Kyu-Sang Park, Han-Kyu Chi, Hyun-Chang Kim, Dong-Wook Kim, Mu Hee Cho
- Issue Date
- 2011-12
- Citation
- Optics Express, v.19, no.27, pp.26936-26947
- ISSN
- 1094-4087
- Publisher
- Optical Society of America(OSA)
- Language
- English
- Type
- Journal Article
- Abstract
- We present high performance silicon photonic circuits (PICs) defined for off-chip or on-chip photonic interconnects, where PN depletion Mach-Zehnder modulators and evanescent-coupled waveguide Ge-on-Si photodetectors were monolithically integrated on an SOI wafer with CMOS-compatible process. The fabricated silicon PICoff-chip for off-chip optical interconnects showed operation up to 30 Gb/s. Under differential drive of low-voltage 1.2 Vpp, the integrated 1 mm-phase-shifter modulator in the PIC off-chip demonstrated an extinction ratio (ER) of 10.5dB for 12.5 Gb/s, an ER of 9.1dB for 20 Gb/s, and an ER of 7.2 dB for 30 Gb/s operation, without adoption of travelling-wave electrodes. The device showed the modulation efficiency of V?L? ~1.59 Vcm, and the phase-shifter loss of 3.2 dB/mm for maximum optical transmission. The Ge photodetector, which allows simpler integration process based on reduced pressure chemical vapor deposition exhibited operation over 30 Gb/s with a low dark current of 700 nA at -1V. The fabricated silicon PICintra-chip for on-chip (intra-chip) photonic interconnects, where the monolithically integrated modulator and Ge photodetector were connected by a silicon waveguide on the same chip, showed on-chip data transmissions up to 20 Gb/s, indicating potential application in future silicon on-chip optical network. We also report the performance of the hybrid silicon electronic-photonic IC (EPIC), where a PICintra-chip chip and 0.13μm CMOS interface IC chips were hybridintegrated. © 2011 Optical Society of America.
- KSP Keywords
- CMOS-compatible, Coupled waveguide, Differential drive, Extinction Ratio(ER), Ge-on-Si, High performance, IC chip, Low dark current, Low voltage, Mach-Zehnder(MZ), Optical Interconnects
This work is distributed under the term of Creative Commons License (CCL)
(CC BY)
(CC BY)
